Improvement of isothermal characteristic of isothermal chamber by filling with graded copper foam

Due to the isotropy and high thermal conductivity of metal foam, a novel idea isothermal chamber filled with graded copper foam (GCF) is developed improve characteristic chamber. Firstly, an analytical effective (ETC) prediction model proposed, relative root-mean-square error (RRMSE) 6.90%, which has higher ETC accuracy than semi-empirical models in literatures. Secondly, conventional porous random fiber bundle replaced by as filler material characteristic, this more accurate used numerical simulation discharge process determine homogeneous (HCF). Experiments are conducted verify results simulation. Thirdly, filling method adopted form GCF, enhance heat transfer efficiency further characteristic. The show that, compared bundle, GCF improved 32.7%.